Mold Makes Collecting Samples Easier & Safer!

Qualitek offers solder analysis for the very popular Sn100C and Sn100E alloys in addition to the wide variety of alloys already available. See below chart for complete programs.

Periodic solder pot analysis is necessary to maintain solder pot integrity and avoid contaminants that may cause a variety of quality and solderability issues. A solder anaylsis is recommended every 2-3 months depending on the amount of PCB's processed. We will have the results within one day. To best suit your needs, there are several solder check-up programs for leaded as well as lead free pots. (A, B and C) are for leaded pots and (LF-1, LF-2, and LF-3) are for lead free pots. Customers have the option to purchase prepaid mailer's at a discount or send the solder sample through UPS or postal mail. Solder check-up provides customers the status of solder impurities as well as the level of tin. This aids in identifying any solder joints or process problems. You may click on the below Solder Analysis for more details or request a quote through e-mail after veiwing the below programs offered.

SOLDER CHECK ANALYSIS PROGRAM TIN/LEAD SOLDER CHECK ANALYSIS PROGRAM LEAD FREE
Program A
Economical Includes:
Program B
Standard Includes:
Program C
Complete Includes:
Program LF-1 Program LF-1 Program LF-3
Below Alloys Program A Alloys + Program A & B Alloys + Below Alloys All LF-1 Alloys + All LF-1 & LF-2 Alloys +
Tin Cadmium Sulfur Copper Cadmium Sulfur
Antimony Indium Phosphorus Silver Zinc Phosphorus
Gold Zinc Gold Aluminum Germanium
Copper Aluminum Antimony Iron Cobalt
Lead (Balance) Iron Lead Arsenic
Arsenic Tin (Balance) Nickel
Silver Indium
Nickel Bismuth
Bismuth
SOLDER CHECK ANALYSIS PROGRAM TIN/LEAD SOLDER CHECK ANALYSIS PROGRAM LEAD FREE
Learn More...

Recommended Lead Free Solder Alloy TAL (Take Action Limits)

Take Action Limits, also known as ‘dump pot specifications,’ are very important to any electronics manufacturing company using flow soldering techniques either in selective soldering or wave soldering. Impurities in solder can cause the characteristics of the alloy to change and result in assembly defects that can cost thousands of dollars.

Recommended Leaded Solder Alloy
TAL(Take Action Limits)
Element TAL* Comments
Preconditioning Pot/Wave
Copper (Cu) 0.750 0.300 Above 1.00% may cause bridging and sluggish solder flow.
Bismuth (Bi) 0.250 0.250 If levels exceed 0.2% contamination source should be investigated.
Zinc (Zn) 0.008/td> 0.005 May cause higher levels of bridging, icicling and surface oxidation.
Iron (Fe) 0.020 0.020 Indicator of pot erosion and may cause joint gritty formation and the formation of FeSn2.
Silver (Ag) 0.750 0.100 Solderability can be affected.
Antimony (Sb) 0.500 0.500 Enhances thermal fatique and joint strength.
Nickel (Ni) 0.025 0.010 Solder drossing, sluggish.
Cadmium(Cd) 0.010 0.005 RoHS Directive 2002/95/EC Maximum. e
Aluminum (Al) 0.008 0.006 May cause higher levels of bridging, icicling and surface oxidation.
Gold (Au) 0.500 0.200 At levels above 0.1% joint strength may be compromised. Sluggish solder.
Arsenic (As) 0.030 0.030 Levels greater than 0.03% can cause de-wetting.
*Per J-STD-001

Recommended Lead Free Solder Alloy
TAL(Take Action Limits)

Element TAL* Comments
SAC305 SN100E
Tin (Sn) BAL BAL
Lead (Pb) 0.10 0.10 RoHS Directive 2002/95/EC Maximum.
Copper (Cu) 0.30-1.00 0.30-1.00 Above 1.00% may cause bridging and sluggish solder flow.
Bismuth (Bi) 0.20 0.20 If levels exceed 0.2% contamination source should be investigated.
Zinc (Zn) 0.003 0.003 May cause higher levels of bridging, icicling and surface oxidation.
BAL BAL
Iron (Fe) 0.02 0.02 Indicator of pot erosion and may cause joint gritty formation and the formation of FeSn2.
Silver (Ag) 2.8-3.5 0.20 Solderability can be affected.
Antimony (Sb) 0.20 0.20 Lead free alloys can tolerate up to 1.0%.
Nickel (Ni) 0.05 <0.01* 0.05 * Solder drossing, sluggish. Slow wetting speed and reduce hole fill.
BAL BAL
Cadmium (Cd) 0.003 0.003 RoHS Directive 2002/95/EC Maximum.
Aluminum (Al) 0.002 0.002
Gold (Au) 0.10 0.10 At levels above 0.1% joint strength may be compromised.
Arsenic (As) 0.03 0.03 Levels greater than 0.03% can cause de-wetting.
Cobalt (Co) N/A <0.01 Solderability can be affected and long term joint reliability at risk.
Germanium (Ge) N/A <0.005* * Solder drossing, sluggish.
* Applies to a popular Sn/Cu/Ni/Ge alloy only.

This data is based on information that the mfg. believed to be reliable and offered in good faith. Qualitek International, Inc. makes no warranties expressed or implied as to its accuracy and assumes no responsibilities and liabilities arising out of its use by others as conditions and methods of use of the products are beyond the control of Qualitek International, Inc. The user must determine the suitability of the product before using it on a commercial basis. The warranties extend only t the conformity of the product to the physical descriptions. In no event will Qualitek International, Inc. be responsible for special, incidental and consequential damages whether the claim is in contract, negligence r otherwise. Qualitek specifically disclaims an liability for consequential or incidental damages of any kind, including lost profits.