SOLDER PASTE

LEADED SOLDER PASTE

Formulated for finepitch printability, increased stencil life, high tack force and good wetting. Designed for surface mount and other electronic assembly applications. Qualitek’s RA and RMA solder pastes are designed to meet or exceed J-STD-004/J-STD-005.

LEAD-FREE SOLDER PASTE

Formulated for finepitch printability, increased stencil life, high tack force and good wetting. Formulated to accommodate a broad range of SMT applications where water/aqueous post reflow cleaning is required. RMA lead free solder paste exhibit superior joint strength, excellent wettability and brick like print definition.

OTHERS

Please send us your formulation.

Email
Lead Type
Leaded Lead-Free

Alloy Type (Please Select a Lead Type)

Flux Type
Packaging
Suggestions

Maximum of 400 characters.